The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2008
Filed:
Oct. 14, 2005
Muneo Kodaira, Tsuchiura, JP;
Shingo Watanabe, Tsuchiura, JP;
Gen Sasaki, Tsuchiura, JP;
Yasuyuki Ito, Tsuchiura, JP;
Katsumi Nomura, Tsuchiura, JP;
Muneo Kodaira, Tsuchiura, JP;
Shingo Watanabe, Tsuchiura, JP;
Gen Sasaki, Tsuchiura, JP;
Yasuyuki Ito, Tsuchiura, JP;
Katsumi Nomura, Tsuchiura, JP;
Hitachi Cable, Ltd., Tokyo, JP;
Abstract
A copper foilcomprises a roughened plating layer, a Ni—Co alloy plating layer, a zinc galvanized (underlying) layer, a chromate treatment layer, and a silane coupling treatment layeron a surface to be bonded with a base material for a printed circuit board, and the chromate treatment layeris formed by using a trivalent chromium conversion treatment solution containing 70 mg/L or more and less than 500 mg/L of trivalent chromium ions converted into metal chromium and having a pH-value of 3.0 to 4.5. According to the present invention, a copper foil for a printed circuit board, a method for fabricating the same, and a trivalent chromium conversion treatment solution used for fabricating the same, which have an excellent controllability in Zn film forming amount and chromate film forming amount can be obtained.