Shingo Watanabe

Title: Shingo Watanabe: Nickel Plating and Printed Circuit Board Copper Foil Innovations.

Introduction

Shingo Watanabe is an inventor associated with Tsuchiura, Japan, and Hitachi Cable, Inc. His patent work focuses on nickel plating solutions and copper foil technologies for printed circuit boards. The supplied information lists 2 patents.

Latest Patents

One of Watanabe’s listed inventions concerns a nickel plating solution and its preparation method, a nickel plating method, and copper foil for printed wiring boards. The described preparation method dissolves nickel sulfate and either sodium citrate or citric acid in water, without adding nickel chloride, and adjusts the solution to a pH of at least 2 and below 4. An alternative preparation method uses the same specified ingredients and pH range but omits boric acid.

Another listed invention covers copper foil for printed circuit boards, its fabrication method, and a trivalent chromium conversion treatment solution. The copper foil’s bonding surface includes roughened plating, a nickel-cobalt alloy plating layer, a zinc underlying layer, a chromate treatment layer, and a silane coupling treatment layer. The treatment solution contains trivalent chromium ions and has a pH of 3.0 to 4.5. The invention aims to improve control over the amounts of zinc and chromate deposited.

Career Highlights

Watanabe’s listed patent contributions address materials and processes used in printed circuit board manufacturing. His work includes plating-solution preparation and layered copper foil treatments intended to support controlled surface formation.

Collaborations

The supplied information identifies Katsumi Nomura and Yasuyuki Ito as Watanabe’s coworkers at Hitachi Cable, Inc.

Conclusion

Shingo Watanabe’s listed inventions focus on nickel plating and treated copper foil, with applications in printed circuit board production.