The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2006
Filed:
Oct. 12, 2005
Yasuyuki Ito, Tsuchiura, JP;
Katsuyuki Matsumoto, Hitachi, JP;
Kenji Yokomizo, Taito, JP;
Yasuhiro Kusano, Inashiki-gun, JP;
Shinichiro Shimizu, Abiko, JP;
Muneo Kodaira, Tsuchiura, JP;
Katsumi Nomura, Tsuchiura, JP;
Yasuyuki Ito, Tsuchiura, JP;
Katsuyuki Matsumoto, Hitachi, JP;
Kenji Yokomizo, Taito, JP;
Yasuhiro Kusano, Inashiki-gun, JP;
Shinichiro Shimizu, Abiko, JP;
Muneo Kodaira, Tsuchiura, JP;
Katsumi Nomura, Tsuchiura, JP;
Hitachi Cable, Ltd., Tokyo, JP;
Abstract
A copper foil for a printed circuit board has a rust preventing layer formed by a trivalent chromium chemical conversion treatment on a surface of the copper foil that the copper foil is bonded to a base material for the printed circuit board. T copper foil is of copper or copper alloy, and the rust preventing layer contains 0.5 to 2.5 μg/cmof chromium converted into metallic chromium.