Yasuhiro Kusano

Title: Yasuhiro Kusano and His Contributions to Plating and Printed Circuit Board Materials.

Introduction

Yasuhiro Kusano is an inventor associated with Inashiki, Japan, and Hitachi Cable, Inc. His patent work addresses nickel plating solutions and protective treatments for copper foil used in printed circuit boards. The supplied information lists 2 patents.

Latest Patents

One of Kusano’s listed inventions concerns a nickel plating solution and methods for preparing and using it. The preparation method dissolves nickel sulfate in water at a concentration of at least 100 g/L and less than 200 g/L, together with either 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid. It excludes nickel chloride and adjusts the resulting solution to a pH of at least 2 and less than 4. An alternative preparation method uses the same specified ingredients and pH range but excludes boric acid.

Another listed invention concerns copper foil for printed circuit boards, with environmental conservation considered in its protective treatment. It describes a rust-preventing layer formed through trivalent chromium chemical conversion on the copper-foil surface bonded to the board’s base material. The layer contains 0.5 to 2.5 μg/cm² of chromium converted into metallic chromium.

Career Highlights

Kusano’s listed patents focus on materials and processes relevant to printed circuit board manufacturing. His work includes controlling the composition and acidity of nickel plating solutions, as well as applying a chromium-based protective layer to copper foil.

Collaborations

Kusano is associated with Hitachi Cable, Inc. The supplied information also names Katsumi Nomura and Katsuyuki Matsumoto as coworkers.

Conclusion

Yasuhiro Kusano’s listed inventions address nickel plating chemistry and corrosion protection for printed circuit board copper foil, reflecting a focus on materials and manufacturing processes.