Motoo Suwa

Title: Motoo Suwa: Innovator in Semiconductor Technology

Introduction

Motoo Suwa is a prominent inventor based in Koganei, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on improving the reliability and efficiency of semiconductor devices.

Latest Patents

One of Suwa's latest patents is for a semiconductor integrated circuit device and fabrication method. This invention involves the formation of first metal balls on electrode pads of a semiconductor chip, which can have sharp-tipped anchors. These anchors are flattened to equalize their height, allowing for effective bonding to electrodes on a substrate. The process can also involve second metal balls that are heated during bonding to enhance the connection.

Another notable patent is for a semiconductor device and method for manufacturing the same. This invention features a high reliability wiring conductor structure suitable for DRAMs and SRAMs. It includes a first wiring conductor film with specific resistance and allowable current density parameters, along with a second wiring conductor film that has a laminated layer structure. This design minimizes electrical resistance increases due to electromigration, even under large current conditions.

Career Highlights

Throughout his career, Motoo Suwa has worked with notable companies such as Hitachi, Ltd. and Hitachi Vlsi Engineering Corporation. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Suwa has collaborated with several professionals in his field, including Norio Nakazato and Tatsuo Itagaki. These collaborations have likely enriched his work and led to advancements in semiconductor technology.

Conclusion

Motoo Suwa is a distinguished inventor whose contributions to semiconductor technology have had a lasting impact. His innovative patents and career achievements reflect his dedication to advancing the field.