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Years Active: 2005
Title: Morihiko Mouri: Innovator in Semiconductor Packaging
Introduction
Morihiko Mouri is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique packaging solution for semiconductor devices.
Latest Patents
Mouri holds a patent for a "Package for mounting semiconductor device." This invention features a package that has a surface exposed to the atmosphere. The exposed surface is protected by a covering material, which can be a paint, tape, or seal. This innovation enhances the reliability and performance of semiconductor devices.
Career Highlights
Throughout his career, Morihiko Mouri has worked with prominent companies in the semiconductor industry. He has been associated with Elpida Memory, Inc. and Renesas Eastern Japan Semiconductor, Inc. His experience in these organizations has contributed to his expertise in semiconductor packaging.
Collaborations
Mouri has collaborated with several talented individuals in his field. Notable coworkers include Sadayuki Okuma and Yasushi Takahashi. Their collective efforts have further advanced the technology surrounding semiconductor devices.
Conclusion
Morihiko Mouri's contributions to semiconductor packaging demonstrate his innovative spirit and dedication to advancing technology. His patent and career achievements reflect his significant impact on the industry.