The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2005
Filed:
Apr. 10, 2003
Applicants:
Morihiko Mouri, Tokyo, JP;
Sadayuki Okuma, Tokyo, JP;
Yasushi Takahashi, Tokyo, JP;
Takao Ono, Tokyo, JP;
Yosihiro Sakaguchi, Tokyo, JP;
Atsushi Nakamura, Tokyo, JP;
Toshio Miyazawa, Tokyo, JP;
Inventors:
Morihiko Mouri, Tokyo, JP;
Sadayuki Okuma, Tokyo, JP;
Yasushi Takahashi, Tokyo, JP;
Takao Ono, Tokyo, JP;
Yosihiro Sakaguchi, Tokyo, JP;
Atsushi Nakamura, Tokyo, JP;
Toshio Miyazawa, Tokyo, JP;
Assignees:
Elpida Memory, Inc., Tokyo, JP;
Renesas Eastern Japan Semiconductor, Inc., Tokyo, JP;
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/10 ;
U.S. Cl.
CPC ...
Abstract
A package for mounting a semiconductor device has a surface exposed to an atmosphere. The exposed surface is covered with a covering material such as a paint, a tape or a seal.