Company Filing History:
Years Active: 2010-2023
Title: Mohsen Haji-Rahim: Innovator in Integrated Module Technology
Introduction
Mohsen Haji-Rahim is a notable inventor based in Chapel Hill, NC (US). He has made significant contributions to the field of integrated module technology, holding a total of 8 patents. His work focuses on enhancing the performance and reliability of electronic components through innovative shielding techniques.
Latest Patents
One of his latest patents is for an integrated module with electromagnetic shielding. This invention relates to a shielded integrated module that includes a module substrate with several perimeter bond pads. At least one electronic component is attached to the module substrate and encapsulated by a mold compound. The design features perimeter vertical shield contacts and a shielding structure. The perimeter bond pads surround the electronic component and are encapsulated by the mold compound. Each perimeter vertical shield contact is coupled to a corresponding perimeter bond pad and extends through the mold compound. The top tip of each perimeter vertical shield contact is exposed at the top surface of the mold compound. The shielding structure completely covers the top surface of the mold compound and is in contact with the perimeter vertical shield contacts.
Career Highlights
Mohsen has worked with several prominent companies in the technology sector, including Qorvo, Inc. and RF Micro Devices, Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas in integrated module technology.
Collaborations
Throughout his career, Mohsen has collaborated with talented individuals such as Thong Dang and Howard Joseph Holyoak. These collaborations have contributed to the advancement of his projects and the successful development of his patents.
Conclusion
Mohsen Haji-Rahim is a distinguished inventor whose work in integrated module technology has led to significant advancements in the field. His innovative patents and collaborations highlight his commitment to enhancing electronic component performance.
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