The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Oct. 17, 2014
Applicant:

Rf Micro Devices, Inc., Greensboro, NC (US);

Inventors:

Thong Dang, Summerfield, NC (US);

Mohsen Haji-Rahim, Chapel Hill, NC (US);

Mark Charles Held, High Point, NC (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/11 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H05K 9/00 (2006.01); H01L 23/31 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 23/552 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 24/97 (2013.01); H05K 1/185 (2013.01); H05K 9/0022 (2013.01); H01L 23/3135 (2013.01); H01L 23/3171 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/245 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/8201 (2013.01); H01L 2224/82031 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82136 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1443 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/19105 (2013.01); H05K 3/284 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/10439 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49016 (2015.01); Y10T 29/49117 (2015.01); Y10T 29/49144 (2015.01); Y10T 29/49155 (2015.01);
Abstract

A shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.


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