The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 2021

Filed:

Aug. 19, 2019
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Mohsen Haji-Rahim, Chapel Hill, NC (US);

Howard Joseph Holyoak, High Point, NC (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/532 (2006.01); H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 23/16 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/16 (2013.01); H01L 23/3121 (2013.01); H01L 23/53223 (2013.01); H01L 23/53238 (2013.01); H01L 23/53252 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 25/0655 (2013.01); H01L 25/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/97 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3025 (2013.01);
Abstract

The present disclosure relates to a shielded integrated module, which includes a module substrate with a number of perimeter bond pads, at least one electronic component attached to the module substrate and encapsulated by a mold compound, a number of perimeter vertical shield contacts, and a shielding structure. The perimeter bond pads are surrounding the at least one electronic component and encapsulated by the mold compound. Each perimeter vertical shield contact is coupled to a corresponding perimeter bond pad and extends through the mold compound, such that a top tip of each perimeter vertical shield contact is exposed at a top surface of the mold compound. The shielding structure completely covers the top surface of the mold compound and is in contact with the perimeter vertical shield contacts.


Find Patent Forward Citations

Haji-Rahim, Mohsen. (2021). Integrated module with electromagnetic shielding (U.S. Patent No. 11139250). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11139250

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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