Brossard, Canada

Mohommad Choudhuri

This inventor holds 3 USPTO granted patents. Top assignee: Nxp USA, Inc.. Active years: 2017-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mohommad Choudhuri. Retrieved from https://idiyas.com/inventor/mohommad-choudhuri

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.6

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2017-2019

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3 patents (USPTO):Explore Patents

Title: Mohommad Choudhuri: Semiconductor Inventions and Patents

Introduction

Mohommad Choudhuri is an inventor based in Brossard, Canada, whose patent work focuses on semiconductor devices and manufacturing processes. He is associated with NXP USA, Inc. His portfolio includes 3 patents.

Latest Patents

Choudhuri’s listed patent work includes “Method of Integrating a Copper Plating Process in a Through-Substrate-Via (TSV) on CMOS Wafer.” The invention concerns a semiconductor device with a TSV interconnect and methods for forming that interconnect.

Another listed invention, “Integrated Capacitive Humidity Sensor,” describes a capacitive sensor with a moisture-sensitive polymer layer electrografted to a conductive metal layer on a CMOS or combined MEMS and CMOS substrate. The sensor is exposed through an opening in a passivation layer, and the patent also addresses device packaging and methods for forming the sensor.

Career Highlights

Choudhuri’s patent contributions address both semiconductor fabrication and sensor integration. The TSV work concerns interconnect formation, while the humidity-sensor invention combines moisture-sensitive materials with semiconductor device structures.

Collaborations

His listed coworkers include Qing Zhang and Gul Zeb. These names reflect professional connections associated with his patent-related work.

Conclusion

Mohommad Choudhuri’s inventions highlight contributions to semiconductor interconnect manufacturing and integrated humidity sensing, developed in connection with NXP USA, Inc.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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