Mohiuddin M Mazumder

Title: Mohiuddin M Mazumder: Innovator in Interconnect Technology

Introduction

Mohiuddin M Mazumder is a prominent inventor based in San Jose, CA (US). He has made significant contributions to the field of interconnect technology, holding a total of 13 patents. His work primarily focuses on enhancing communication interfaces and improving data transmission efficiency.

Latest Patents

Among his latest patents is the innovation titled "Extending multichip package link off package." This invention provides an interconnect interface that enables communication with off-package devices over a link comprising multiple lanes. The logic of this interface includes receiver logic that can receive a valid signal from the off-package device, indicating that data is to arrive on dedicated data lanes. Additionally, he has developed a patent for a "High performance interconnect," which includes a receiver that can determine the number of extension devices on a link and send clock compensation ordered sets based on that determination.

Career Highlights

Mohiuddin M Mazumder is currently employed at Intel Corporation, where he continues to innovate and contribute to advancements in technology. His expertise in interconnect systems has positioned him as a key player in the development of high-performance communication solutions.

Collaborations

Throughout his career, Mohiuddin has collaborated with notable colleagues, including Zuoguo Wu and Debendra Das Sharma. These collaborations have further enriched his work and contributed to the success of various projects.

Conclusion

Mohiuddin M Mazumder's contributions to interconnect technology and his impressive portfolio of patents highlight his role as a leading inventor in the field. His ongoing work at Intel Corporation continues to push the boundaries of innovation in communication technology.