This inventor holds 2 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2007.
Company Filing History:
Years Active: 2007
Title: Innovations by Mohd Erwan B Basiron
Introduction
Mohd Erwan B Basiron is a notable inventor based in Pulau Pinang, Malaysia. He has made significant contributions to the field of technology, particularly in the development of innovative solutions for electronic components. With a total of 2 patents to his name, his work focuses on enhancing the reliability and performance of electronic assemblies.
Latest Patents
His latest patents include "Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same." This invention involves the formation of a stress-relief layer by dispensing a polymer upon a substrate lower surface. This process allows for the partial embedding of a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump, providing enhanced durability. Additionally, a stress-compensation collar is formed on a board to which the substrate is mated, further embedding the low melting-point solder bump. This innovative design is crucial for improving the performance of computing systems that utilize these components.
Career Highlights
Mohd Erwan B Basiron is currently employed at Intel Corporation, where he continues to push the boundaries of technology through his inventive work. His contributions have been instrumental in advancing the field of electronics, particularly in the area of soldering techniques and stress management in electronic assemblies.
Collaborations
He has collaborated with notable colleagues such as Daewoong Suh and Saikumar Jayaraman, contributing to a dynamic work environment that fosters innovation and creativity.
Conclusion
Mohd Erwan B Basiron's work exemplifies the spirit of innovation in the technology sector. His patents not only address current challenges in electronic assembly but also pave the way for future advancements in the field.