Mohamad Ridzwan Mustafa

Title: Mohamad Ridzwan Mustafa: Innovator in Wafer Plating Technology

Introduction

Mohamad Ridzwan Mustafa is a notable inventor based in Johor Bahru, Malaysia. He has made significant contributions to the field of electroplating technology, particularly with his innovative designs for wafer plating fixtures. With a total of 2 patents to his name, he continues to push the boundaries of what is possible in substrate processing.

Latest Patents

One of his latest patents is a dual wafer plating fixture designed for a continuous plating line. This innovative fixture allows for the simultaneous electroplating of two substrates. The design includes an electrically conductive carrier bus and a plurality of contact clips that hold the substrates in place while electrically coupling them to the carrier bus. Additionally, a non-conductive substrate backer is used to separate the two substrates. The method of electroplating involves mounting the two substrates onto the fixture, placing it on a continuous belt of the plating system, dipping it into an electroplating bath, and applying voltage to the substrates via the fixture.

Career Highlights

Throughout his career, Mohamad Ridzwan Mustafa has worked with prominent companies in the solar energy sector, including Maxeon Solar Pte. Ltd. and SunPower Corporation. His experience in these organizations has allowed him to refine his skills and contribute to advancements in solar technology.

Collaborations

He has collaborated with notable professionals in the industry, including Hung-Ming Wang and Paul Loscutoff. These collaborations have further enriched his work and expanded his impact in the field.

Conclusion

Mohamad Ridzwan Mustafa is a distinguished inventor whose work in wafer plating technology has made a significant impact on the industry. His innovative patents and collaborations highlight his commitment to advancing technology in substrate processing.