The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Feb. 08, 2023
Maxeon Solar Pte. Ltd., Singapore, SG;
Hung-Ming Wang, San Jose, CA (US);
Paul W. Loscutoff, Castro Valley, CA (US);
Raphael M. Manalo, San Jose, CA (US);
Arnold V. Castillo, Batangas, PH;
Mohamad Ridzwan Mustafa, Johor Bahru, MY;
Mark A. Kleshock, Phoenix, AZ (US);
Neil G. Bergstrom, Los Altos, CA (US);
Maxeon Solar Pte. Ltd., Singapore, SG;
Abstract
A wafer plating fixture for use in simultaneously electroplating a two substrates. The wafer plating fixture including: an electrically conductive carrier bus; a plurality of contact clips electrically coupled to the carrier bus and configured to hold the two substrates in place and electrically couple the two substrates to the carrier bus; and a non-conductive substrate backer to separate the two substrates coupled to the carrier bus. A method of electroplating a plurality of substrates. The method including: mounting two substrates to be plated onto a wafer plating fixture; mounting the wafer plating fixture on a continuous belt of plating system; dipping the wafer plating fixture with the two substrates held thereon into an electroplating bath; and applying a voltage to the two substrates via the wafer plating fixture.