Neil G Bergstrom

Title: Neil G. Bergstrom: Innovator in Wafer Plating Technology

Introduction

Neil G. Bergstrom is a notable inventor based in Los Altos, California. He has made significant contributions to the field of electroplating technology, particularly in the development of innovative wafer plating fixtures. With a total of 2 patents to his name, Bergstrom's work has advanced the efficiency and effectiveness of substrate plating processes.

Latest Patents

Bergstrom's latest patent is a dual wafer plating fixture designed for use in a continuous plating line. This innovative fixture allows for the simultaneous electroplating of two substrates. The design includes an electrically conductive carrier bus and a plurality of contact clips that hold the substrates in place while electrically coupling them to the carrier bus. Additionally, a non-conductive substrate backer is incorporated to separate the two substrates. The method of electroplating involves mounting the substrates onto the fixture, placing it on a continuous belt of the plating system, dipping it into an electroplating bath, and applying voltage to the substrates via the fixture.

Career Highlights

Throughout his career, Neil G. Bergstrom has worked with prominent companies in the solar energy sector, including Maxeon Solar Pte. Ltd. and SunPower Corporation. His experience in these organizations has contributed to his expertise in the field of electroplating and substrate technology.

Collaborations

Bergstrom has collaborated with notable professionals in his field, including Hung-Ming Wang and Paul Loscutoff. These collaborations have likely enriched his work and contributed to the development of his patented technologies.

Conclusion

Neil G. Bergstrom's contributions to wafer plating technology demonstrate his innovative spirit and commitment to advancing the field. His patents reflect a deep understanding of electroplating processes, making him a significant figure in the industry.