Sunpower Corporation

Maxeon Solar Pte. Ltd.

Mohamad Ridzwan Mustafa

Paul Loscutoff

Hung-Ming Wang

Mark A Kleshock

Raphael M Manalo

Neil G Bergstrom

Arnold Villamor Castillo

Arnold V Castillo

A wafer plating fixture for use in simultaneously electroplating a two substrates. The wafer plating fixture including: an electrically conductive carrier bus; a plurality of contact clips electrically coupled to the carrier bus and configured to hold the two substrates in place and electrically couple the two substrates to the carrier bus; and a non-conductive substrate backer to separate the two substrates coupled to the carrier bus. A method of electroplating a plurality of substrates. The method including: mounting two substrates to be plated onto a wafer plating fixture; mounting the wafer plating fixture on a continuous belt of plating system; dipping the wafer plating fixture with the two substrates held thereon into an electroplating bath; and applying a voltage to the two substrates via the wafer plating fixture.

Dual wafer plating fixture for a continuous plating line

Growing community of inventors

Johor Bahru, Malaysia

Mohamad Ridzwan Mustafa