Miyuki Akazawa

Title: The Innovative Contributions of Miyuki Akazawa

Introduction

Miyuki Akazawa is a prominent inventor based in Shinjuku-ku, Japan. She has made significant contributions to the field of multilayer wiring board manufacturing. With a total of three patents to her name, her work has advanced the technology used in electronic components.

Latest Patents

Miyuki Akazawa's latest patents focus on methods of manufacturing multilayer wiring boards. One of her notable inventions describes a manufacturing method that includes a core board, a wiring layer, and an electrically insulating layer stacked on the core board. This method involves forming a plurality of through holes in a core member, with the thermal expansion coefficient of the core board ranging between 2 to 20 ppm. The core member can be made from materials such as silicon, ceramics, glass, a glass-epoxy composite, or metal. The through holes are made conductive using a conductive material, allowing electrical connections between the front and back of the core board. Additionally, a wiring layer and an electrically insulating layer are stacked on one surface of the core board, while a capacitor is formed on the opposite surface.

Career Highlights

Miyuki Akazawa is currently employed at Dai Nippon Printing Co., Ltd., where she continues to innovate in her field. Her work has been instrumental in enhancing the efficiency and functionality of multilayer wiring boards.

Collaborations

Miyuki collaborates with talented coworkers, including Toshiaki Mori and Kazunori Nakamura. Their combined expertise contributes to the success of their projects and the advancement of technology in their industry.

Conclusion

Miyuki Akazawa's contributions to the field of multilayer wiring board manufacturing demonstrate her innovative spirit and dedication to advancing technology. Her patents reflect her commitment to improving electronic components, making her a significant figure in her field.