The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2006
Filed:
Dec. 10, 2003
Toshiaki Mori, Tokyo, JP;
Kazunori Nakamura, Tokyo, JP;
Satoru Kuramochi, Tokyo, JP;
Miyuki Akazawa, Tokyo, JP;
Koichi Nakayama, Tokyo, JP;
Toshiaki Mori, Tokyo, JP;
Kazunori Nakamura, Tokyo, JP;
Satoru Kuramochi, Tokyo, JP;
Miyuki Akazawa, Tokyo, JP;
Koichi Nakayama, Tokyo, JP;
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Abstract
In a multilayer wiring board comprising a core board, and a wiring layer and an electrically insulating layer that are stacked on one surface of said core board, a thermal expansion coefficient of said core board in XY directions falls within a range of 2 to 20 ppm, a core member for said core board is a core member selected from silicon, ceramics, glass, a glass-epoxy composite, and metal, said core board is provided with a plurality of through holes that are made conductive between the front and the back by a conductive material, and a capacitor is provided on one surface of said core board, wherein said capacitor comprises an upper electrode being the conductive material in said through hole, and a lower electrode disposed so as to confront said upper electrode via a dielectric layer.