Minoru Kimura

Title: Minoru Kimura: Innovator in Semiconductor Technology

Introduction

Minoru Kimura is a prominent inventor based in Tachikawa, Japan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to fabrication methods.

Latest Patents

Kimura's latest patents focus on a fabrication method of semiconductor integrated circuit devices. This technique is capable of stably releasing chips from a dicing tape. It involves grinding the back surface of a semiconductor wafer while adhering a pressure-sensitive adhesive tape to the circuit-forming surface of the wafer. This process achieves a predetermined thickness and forcibly oxidizes the back surface of the semiconductor wafer. After releasing the pressure-sensitive adhesive tape, a dicing tape is adhered to the back surface of the wafer. The semiconductor wafer is then diced into individual chips, and the back surface of each chip is pressed by the dicing tape, allowing for the stable release of the chips.

Career Highlights

Minoru Kimura is associated with Renesas Technology Corporation, where he has been instrumental in advancing semiconductor technologies. His work has significantly impacted the efficiency and reliability of semiconductor manufacturing processes.

Collaborations

Kimura has collaborated with notable colleagues, including Chuichi Miyazaki and Yoshiyuki Abe. Their combined expertise has contributed to the successful development of innovative semiconductor solutions.

Conclusion

Minoru Kimura's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the industry and pave the way for future advancements.