This inventor holds 1 USPTO granted patent. Top assignee: Tong Hsing Electronic Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Ming-yen Pan and Power Component Submount Innovation.
Introduction
Ming-yen Pan is an inventor associated with Taoyuan, Taiwan, and Tong Hsing Electronic Industries, Ltd. His work includes a patented design for a power component submount and a method for manufacturing it.
Latest Patents
Pan is credited with 1 patent: “Power Component Submount and Manufacturing Method Thereof.” The invention describes a ceramic substrate with a sputtering layer and a conductive block formed on an electroplating portion of that layer. Three electroless plating layers are stacked on the conductive block, using either gold, palladium, and gold, or nickel, palladium, and gold. The outermost layer is designed to provide a mounting surface for a power component.
Career Highlights
Pan’s patent focuses on the structure and manufacture of a submount intended to support power components. The design combines a ceramic substrate, conductive materials, and layered plating to create the component-mounting surface.
Collaborations
Pan is associated with Tong Hsing Electronic Industries, Ltd. His listed coworkers include Jia-Zheng Xu and Jhih-wei Lai.
Conclusion
Ming-yen Pan’s patented submount design brings together ceramic, conductive, and plated layers to provide a mounting structure for power components.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile