Ming-Wei Tien

Title: Ming-Wei Tien: Patents in Thermal Management and Electronic Device Design.

Introduction

Ming-Wei Tien is an inventor based in Taipei, Taiwan. His work includes inventions related to heat dissipation and the design of electronic devices. He is associated with Wistron Corporation and holds 2 patents.

Latest Patents

Tien’s listed patents address thermal management and component removal in electronic devices.

“Heat dissipating device and heat dissipating fin” describes a cooling assembly with a base, a heat pipe, and alternating first and second heat-dissipating fins. The second fins have cut edges and a smaller area than the first fins. This arrangement is designed to reduce airflow resistance, increase airflow through the device, and improve heat dissipation.

“Electronic device with component detaching function” describes a casing with an opening, a movable cover, and a detachable electronic component. Connecting portions on the cover and component engage so that removing the component slides the cover between two positions.

Career Highlights

Tien’s patent work reflects an emphasis on practical engineering solutions: improving airflow in cooling hardware and enabling a component to be detached while moving a device cover. He is associated with Wistron Corporation.

Collaborations

Yen-Yu Chao and Yao-De Huang are identified as Tien’s coworkers. The information provided does not specify their roles in the listed patents.

Conclusion

Ming-Wei Tien’s patents focus on thermal efficiency and serviceable electronic-device design, illustrating two complementary areas of innovation in hardware engineering.