Wistron Corporation

Ming-Wei Tien

Ming-Chang Wu

Jeng-Ming Lai

Yao-De Huang

Yen-Yu Chao

A heat dissipating device includes a base, a heat pipe disposed on the base, and a plurality of first and second heat dissipating fins. Each first heat dissipating fin includes a fin body having a first through hole for extension of the heat pipe therethrough. The first and second heat dissipating fins are mounted on the heat pipe in a stack and in a spaced-apart alternating arrangement. Each second heat dissipating fin includes a fin body having a second through hole for extension of the heat pipe therethrough, two adjacent lateral edges, and a cut edge interconnecting the lateral edges such that each second heat dissipating fin has a smaller area than each first heat dissipating fin. Thus, the flow field resistance of the heat dissipating device can be reduced to increase the amount of airflow through the heat dissipating device for enhancing the heat dissipating efficiency.

Heat dissipating device and heat dissipating fin

An electronic device with component detaching function includes a casing, a cover and an electronic component. An opening is formed on the casing. The cover is adapted to shelter the opening. The cover is movably disposed on the casing close to the opening, and can move relative to the casing to be switched between a first position and a second portion. The cover includes a first connecting portion. The electronic component including a second connecting portion is detachably disposed on the opening. The second connecting portion is detachably assembled with the first connecting portion. When the electronic component is separated from the casing, the electronic component utilizes an assembly of the first connecting portion and the second connecting portion to slide the cover relative to the casing, and the cover moves from the first position to the second portion.

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Taipei Hsien, Taiwan

Ming-Wei Tien