The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2017

Filed:

Nov. 05, 2013
Applicant:

Wistron Corporation, Taipei Hsien, TW;

Inventors:

Yen-Yu Chao, Taipei Hsien, TW;

Ming-Chang Wu, Taipei Hsien, TW;

Ming-Wei Tien, Taipei Hsien, TW;

Assignee:

WISTRON CORPORATION, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/467 (2006.01); F28D 15/02 (2006.01); F28F 1/32 (2006.01); H01L 23/367 (2006.01); H01L 23/427 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
F28D 15/02 (2013.01); F28F 1/32 (2013.01); H01L 23/3672 (2013.01); H01L 23/427 (2013.01); H01L 23/467 (2013.01); F28D 15/0275 (2013.01); H01L 23/4006 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A heat dissipating device includes a base, a heat pipe disposed on the base, and a plurality of first and second heat dissipating fins. Each first heat dissipating fin includes a fin body having a first through hole for extension of the heat pipe therethrough. The first and second heat dissipating fins are mounted on the heat pipe in a stack and in a spaced-apart alternating arrangement. Each second heat dissipating fin includes a fin body having a second through hole for extension of the heat pipe therethrough, two adjacent lateral edges, and a cut edge interconnecting the lateral edges such that each second heat dissipating fin has a smaller area than each first heat dissipating fin. Thus, the flow field resistance of the heat dissipating device can be reduced to increase the amount of airflow through the heat dissipating device for enhancing the heat dissipating efficiency.


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