Ming-Shih Yeh

Title: The Innovations of Ming-Shih Yeh

Introduction

Ming-Shih Yeh is a prominent inventor based in Changhua Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of interconnection structures. With a total of two patents to his name, Yeh's work is recognized for its innovative approaches to material science and fabrication methods.

Latest Patents

Ming-Shih Yeh's latest patents focus on an interconnection structure and its fabrication method. The invention involves forming a first organic low-k material layer, a stress redistribution layer, and a second organic low-k dielectric layer in sequence over a substrate. An opening is created in these layers, which is then filled with a conductive material to establish the interconnection structure. Notably, the stress redistribution layer is designed to have a heat expansion coefficient that is closer to that of the substrate, while differing significantly from the coefficients of the first and second organic low-k material layers.

Career Highlights

Yeh is currently employed at United Microelectronics Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

Ming-Shih Yeh has collaborated with notable colleagues such as Chiung-Sheng Hsiung and Chih-Chao Yang. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Ming-Shih Yeh's contributions to the field of semiconductor technology through his patents and collaborations highlight his role as a key innovator. His work continues to influence advancements in electronic materials and fabrication methods.