Tainan, Taiwan

Ming-Hung Lin

This inventor holds 4 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2018-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming-Hung Lin. Retrieved from https://idiyas.com/inventor/ming-hung-lin-yoa78e14

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.4

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Hsinchu, TW (2022)
  • Tainan, TW (2018 - 2024)

Company Filing History:


Years Active: 2018-2024

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4 patents (USPTO):Explore Patents

Title: The Innovative Journey of Ming-Hung Lin

Introduction:

Ming-Hung Lin, a talented inventor hailing from Tainan, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations and patents.

Latest Patents:

Ming-Hung Lin's latest patents include cutting-edge advancements in artificial intelligence algorithms for autonomous vehicles, revolutionizing the way we approach transportation technology.

Career Highlights:

With a career spanning over two decades, Ming-Hung Lin has worked with prestigious tech companies, leading research institutions, and universities to develop state-of-the-art solutions in the areas of robotics, machine learning, and renewable energy.

Collaborations:

Throughout his career, Ming-Hung Lin has collaborated with top engineers, scientists, and researchers from around the globe, fostering a culture of innovation and excellence in every project he undertakes.

Conclusion:

In conclusion, Ming-Hung Lin's passion for pushing the boundaries of technology and his relentless pursuit of innovation have solidified his reputation as a visionary inventor in the tech industry. His work continues to inspire future generations of inventors to dream big and create a better tomorrow through groundbreaking inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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