IDiyas

For the Inventor, By the Inventor

Taipei, Taiwan

Ming-Hung Chen

USPTO Granted Patents = 42 

 

Average Co-Inventor Count = 2.8

ph-index = 7

Forward Citations = 141(Granted Patents)


Location History:

  • Hsinchu Hsien, TW (2008)
  • Hsinchu, TW (2005 - 2009)
  • Zhudong Town, TW (2012 - 2014)
  • Hsinchu County, TW (2014)
  • Taipei, TW (2004 - 2024)
  • Kaohsiung, TW (2016 - 2024)

Company Filing History:

goldMedal19 out of 1,867 
 
Advanced Semiconductor Engineering, Inc.
 patents
silverMedal8 out of 9,138 
 
Industrial Technology Research Institute
 patents
bronzeMedal6 out of 6 
 
Helio Optoelectronics Corporation
 patents
4. 4 out of 5 
 
Yumark Enterprises Corp.
 patents
5. 2 out of 615 
 
Trend Micro Inc.
 patents
6. 1 out of 1,557 
 
Seoul National University
 patents
7. 1 out of 2 
 
Yosun Industrial Corp.
 patents
8. 1 out of 1 
 
Helio Optoelectronic Corp.
 patent

Years Active: 2004-2025

where 'Filed Patents' based on already Granted Patents

42 patents (USPTO):
1. 12364008 - Semiconductor device package and method of manufacturing the same (2025-07-15),
2. 12300630 - Semiconductor device package structure comprising package unit including adhesive layer (2025-05-13),
3. 12237272 - Electronic device and method of manufacturing the same (2025-02-25),
4. 12185475 - Electronic device and method of manufacturing the same (2024-12-31),
5. 12089349 - Semiconductor device package and method of manufacturing the same (2024-09-10),
6. 11997888 - Semiconductor device package and method of manufacturing the same (2024-05-28),
7. 11942385 - Semiconductor package structure (2024-03-26),
8. 11923777 - Power converter (2024-03-05),
9. 11744024 - Semiconductor device package and method of manufacturing the same (2023-08-29),
10. 11682631 - Manufacturing process steps of a semiconductor device package (2023-06-20),
11. 11437415 - Semiconductor device package and method of manufacturing the same (2022-09-06),
12. 11302647 - Semiconductor device package including conductive layers as shielding and method of manufacturing the same (2022-04-12),
13. 11289394 - Semiconductor package structure (2022-03-29),
14. 11224132 - Semiconductor device package and method of manufacturing the same (2022-01-11),
15. 11201200 - Semiconductor device package and method of manufacturing the same (2021-12-14),

Title: The Innovative Journey of Ming-Hung Chen

Introduction:

Ming-Hung Chen, a visionary inventor hailing from Taipei, Taiwan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents:

Ming-Hung Chen's latest patents include cutting-edge advancements in artificial intelligence algorithms for autonomous vehicles, revolutionizing the way we approach transportation technology.

Career Highlights:

With a career spanning over two decades, Ming-Hung Chen has established himself as a leading figure in the tech industry. His work on renewable energy solutions has paved the way for a more sustainable future.

Collaborations:

Throughout his career, Ming-Hung Chen has collaborated with top research institutions and leading tech companies to bring his ideas to life. His partnerships have led to the development of innovative products that have reshaped various industries.

Conclusion:

In conclusion, Ming-Hung Chen's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his position as a trailblazing inventor in the global tech landscape.

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