Advanced Semiconductor Engineering, Inc.

Industrial Technology Research Institute

Helio Optoelectronics Corporation

Yumark Enterprises Corp.

Trend Micro Inc.

Seoul National University

Yosun Industrial Corp.

Helio Optoelectronic Corp.

Ming-Hung Chen

Chang-Lin Yeh

Sheng-Yu Chen

Shih-Yi Wen

Yung I Yeh

Hsiao-Wen Lee

Jui-Ping Weng

Ching-Jen Pan

Yung-I Yeh

Dao-Long Chen

Wei-Tai Cheng

Chih-Pin Hung

Wu-Cheng Kuo

Tang-Yuan Chen

Che-Fu Yeh

Peng-Shih Pu

Bing-Ru Chen

Hui-Ping Jian

Cheng-Wei Chan

Jing-Yi Chen

Chun-Che Lee

Zheng Wei Wu

Ming-Te Lin

Tzong-Ming Lee

Yu-Min Chang

Chien-Hua Chen

Ming-Yao Lin

Chin-Li Kao

Kuo-Hua Chen

Chieh Hu

Kuang-Yu Tai

Tun-Ching Pi

Hsu-Chiang Shih

Wen-Hsien Wang

Chen-Bin Huang

Min-Tsung Kuan

Yi-Li Cheng

Jin-Yuan Lai

Tse-Chuan Chou

Fu-Ming Lin

Shih-Han Hsu

Yao-Tang Chang

Kwang-Lung Lin

Wen-Hsien Chou

Cheng Hsin Hsu

Li-Feng Chen

Cheng-Fa Chen

Ying-Xu Lu

Wen-Kuei Lee

Pei-Yin Wu

Tsung-Fu Lin

Chi-Hung Pan

Chin Zeng Yeh

Chung-Teng Huang

Hsueh Jen Fu

Rung Chi Chen

Wei-Zhen Qiu

Shih-Chang Shei

Wei-Shyang Wang

Li-Chuan Mau

Yeh-I Su

Wan-Chun Cheng

Jia-Feng Ho

A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.

Semiconductor device package and method of manufacturing the same

The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.

Semiconductor device package structure comprising package unit including adhesive layer

An electronic device is disclosed. The electronic device includes a carrier having a first surface and a first lateral surface, an antenna adjacent to the first surface of the carrier, and a shielding layer covering a portion of the first lateral surface of the carrier. The shielding layer is configured to allow a gain of the antenna to be greater than 20 dB.

Electronic device and method of manufacturing the same

The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.

A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.

A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.

Semiconductor package structure

A power converter is provided. The power converter includes an LLC converter, a feedback circuit, a first driving circuit, and a second driving circuit. The LLC converter includes a first arm transistor group and a second arm transistor group. The feedback circuit provides a feedback signal corresponding to a current value of the LLC converter. The first driving circuit drives the first arm transistor group in response to the feedback signal and provides a control signal. The second driving circuit drives the second arm transistor group in response to the control signal.

Power converter

Manufacturing process steps of a semiconductor device package

The present disclosure provides for a semiconductor device package and a method for manufacturing the same. The semiconductor device package includes a substrate, a conductive element and conductive layers. The substrate has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The conductive element is disposed on the first surface of the substrate. The conductive layers have a first portion on the conductive element and a second portion on the lateral surface of the substrate. A number of layers of the first portion of the conductive layers is different from a number of layers of the second portion of the conductive layers.

Semiconductor device package including conductive layers as shielding and method of manufacturing the same

Growing community of inventors

Taipei, Taiwan

Ming-Hung Chen