This inventor holds 3 USPTO granted patents. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2002-2005.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002-2005
Title: The Innovations of Ming-Hsun Lee
Introduction
Ming-Hsun Lee is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs and patents. With a total of 3 patents to his name, Lee continues to push the boundaries of technology in his industry.
Latest Patents
One of Lee's notable patents is a leadframe-based semiconductor package designed for multi-media card (MMC) chipsets. This innovative package utilizes a leadframe instead of traditional BT substrates or films as the chip carrier. The leadframe features a supporting bar, a chip-supporting structure positioned lower than the supporting bar, and multiple leads. Each lead consists of an outer-lead portion linked to the supporting bar and an inner-lead portion adjacent to the chip-supporting structure. This design allows for the efficient mounting of semiconductor chips, either on a die pad or directly on the inner-lead portions. The leadframe approach simplifies the manufacturing process by eliminating the need for a lidding process, resulting in a more cost-effective and less complex production method.
Career Highlights
Ming-Hsun Lee is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His work focuses on developing advanced packaging solutions that enhance the performance and reliability of semiconductor devices. Lee's expertise and innovative mindset have positioned him as a key player in his field.
Collaborations
Throughout his career, Lee has collaborated with talented individuals such as Ho-Yi Tsai and Chin-Te Chen. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Ming-Hsun Lee's contributions to semiconductor packaging exemplify the spirit of innovation in the technology sector. His patents and collaborative efforts continue to shape the future of the industry, making him a noteworthy figure in the realm of inventions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile