Siliconware Precision Industries Co., Ltd.

Ming-Hsun Lee

Ho-Yi Tsai

Chin-Te Chen

A leadframe-based semiconductor package is proposed for the packaging of a semiconductor device, such as a multi-media card (MMC) chipset. The proposed semiconductor package is characterized by the use of a leadframe, rather than BT substrate or film, as the chip carrier for MMC chipset. The leadframe includes a supporting bar; a chip-supporting structure arranged at a downset position in relation to the supporting bar; and a plurality of leads, each lead including an outer-lead portion and an inner-lead portion; wherein the outer-lead portion is levelly linked to the supporting bar, while the inner-lead portion is arranged beside the chip-supporting structure and linked to the outer-lead portion via an intermediate-lead portion. The leadframe can be either the type having die pad or the type having no die pad. In the case of the type having die pad, a semiconductor chip is mounted on the die pad; and in the case of the type having no die pad, one or more semiconductor chips are mounted over an elongated part of the inner-lead portions of the leads. The use of leadframe allows the MMC package to be manufactured without having to include a lidding process, so that the MMC manufacture can be carried out in a less complex and more cost-effective manner.

Leadframe-based semiconductor package for multi-media card

A leadframe-based semiconductor package is proposed for the packaging of a semiconductor device, such as a multi-media card (MMC) chipset. The proposed semiconductor package is characterized by the use of a leadframe, rather than BT substrate or film, as the chip carrier for MMC chipset. The leadframe includes a supporting bar, a chip-supporting structure arranged at a downset position in relation to the supporting bar; and a plurality of leads, each lead including an outer-lead portion and an inner-lead portion; wherein the outer-lead portion is levelly linked to the supporting bar, while the inner-lead portion is arranged beside the chip-supporting structure and linked to the outer-lead portion via an intermediate-lead portion. The leadframe can be either the type having die pad or the type having no die pad. In the case of the type having die pad, a semiconductor chip is mounted on the die pad; and in the case of the type having no die pad, one or more semiconductor chips are mounted over an elongated part of the inner-lead portions of the leads. The use of leadframe allows the MMC package to be manufactured without having to include a lidding process, so that the MMC manufacture can be carried out in a less complex and more cost-effective manner.

A multi-chip module is proposed, which is designed to pack two or more semiconductor chips in a stacked manner over a chip carrier in a single package. The proposed multi-chip module is characterized by the use of a reverse wire-bonding technique to allow the topmost bent portions of a first set of bonding wires connected to the bottommost chip to be positioned above the substrate rather than above the bottommost chip. Then, an adhesive layer is formed to a thickness that allows it to entirely wrap the part of the bonding wires that is positioned above the active surface of the bottommost chip to prevent the bonding wires connected to the bottommost chip to come in contact with at least one overlaid chip. This allows the prevention of voids between the two stacked chips in the encapsulation body. Moreover, the proposed multi-chip module allows the stacked chips to be variably-sized according actual needs without the problem of the bonding wires being damaged during the mounting of the overlaid chip. The overlaid chip is electrically connected to the substrate by a second set of bonding wires, and an encapsulation body is provided to encapsulate the first semiconductor chip, the first set of bonding wires, the second semiconductor chip, and the second set of bonding wires.

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Taichung, Taiwan

Ming-Hsun Lee