Company Filing History:
Years Active: 2004-2013
Title: **Innovations by Ming-Hsing Liu: Pioneering Fabrication Methods**
Introduction
Ming-Hsing Liu, a notable inventor located in Tainan, Taiwan, has made significant contributions to the field of semiconductor fabrication. With a portfolio of three patents, Liu's innovative techniques are paving the way for advancements in the manufacturing processes of electronic components.
Latest Patents
Ming-Hsing Liu's latest patents showcase his expertise in developing methods for intricate fabrication processes. The first patent, titled "Method for Fabricating Opening," describes a specialized technique for creating openings within a substrate layered with dielectric materials and metal masks. This method is crucial for exposing conductive region surfaces effectively.
Another notable patent is "Method for Fabricating Single-Damascene Structure, Dual Damascene Structure, and Opening Thereof." This innovation outlines a method for creating single-damascene openings by allowing targeted removal of layers on a substrate containing conductive lines. Liu's approach enhances the efficiency of semiconductor manufacturing by streamlining the creation of damascene openings.
Career Highlights
Ming-Hsing Liu currently works at United Microelectronics Corporation (UMC), a leading player in the semiconductor industry. His work in developing these fabrication methods reflects his commitment to advancing technology in material sciences and electronic engineering. Throughout his career, Liu has focused on improving manufacturing processes and enhancing the performance of semiconductors.
Collaborations
Liu often collaborates with talented professionals in his field. His colleagues Chia-Hsiun Yu and Chih-Ning Wu have collaborated on various projects, contributing to the inventive atmosphere at UMC. Together, they strive for innovation in the semiconductor realm, furthering their collective goal of enhancing electronic manufacturing capabilities.
Conclusion
Ming-Hsing Liu's contributions to patentable fabrication methods are vital to the progression of semiconductor technologies. His patents not only address current challenges in the industry but also pave the way for future advancements. With an impressive collaboration network and a strong career at United Microelectronics Corporation, Liu remains a significant figure in the field of innovations and inventions.