Tainan, Taiwan

Ming-Hong Su

This inventor holds 7 USPTO granted patents and 6 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2022-2026.

USPTO Granted Patents = 7 

% Patents Active = 100.0

Average Co-Inventor Count = 7.5

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2022-2026

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7 patents (USPTO):Explore Patents

Title: The Innovations of Ming-Hong Su

Introduction

Ming-Hong Su is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on advancing semiconductor devices and manufacturing processes.

Latest Patents

Ming-Hong Su's latest patents include innovative designs for semiconductor devices. One of his notable inventions involves a method for forming a first terminal of a semiconductor device by depositing a tunneling oxide layer on a body of the device, followed by the application of polysilicon-based material and dielectric layers. This process enhances the efficiency and performance of semiconductor devices. Another significant patent describes a semiconductor structure that includes a first terminal coupled to a substrate, featuring a tunneling layer and a dielectric structure that optimizes the device's functionality.

Career Highlights

Ming-Hong Su is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise and innovative approach have contributed to the company's advancements in semiconductor technology.

Collaborations

Ming-Hong Su has collaborated with notable colleagues, including Yu-Chu Lin and Chi-Chung Jen. Their teamwork has fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Ming-Hong Su's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to shape the future of semiconductor devices and manufacturing processes.

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