Company Filing History:
Years Active: 2021-2024
Title: **Innovations of Min Jun Bae: A Pioneer in Semiconductor Packaging**
Introduction
Min Jun Bae is an accomplished inventor based in Yongin-si, South Korea, known for his significant contributions to the field of semiconductor packaging. With a total of four patents to his name, he has been instrumental in the development of innovative technologies that enhance the performance and reliability of semiconductor devices.
Latest Patents
Among his latest innovations, Min Jun Bae has developed a semiconductor package that features a redistribution substrate with both first and second surfaces. This groundbreaking design incorporates an insulation member and multiple redistribution layers of varying levels. Additionally, it includes redistribution vias that narrow from the second surface to the first surface. The package also utilizes a series of Under Bump Metallization (UBM) layers, which are crucial for enhancing the electrical connections of semiconductor chips placed on the substrate.
Another patent that showcases his ingenuity is a semiconductor package with a first redistribution layer and a plurality of posts. This configuration allows a semiconductor chip to be situated between the posts, with a second redistribution layer formed above. The innovative approach also features a memory stack on the second redistribution layer, further advancing the technology in semiconductor packaging.
Career Highlights
Min Jun Bae is currently employed at Samsung Electronics Co., Ltd., where he plays a vital role in advancing semiconductor technologies. His work has not only enhanced the efficiency of semiconductor packages but has also contributed to the overall success of his employer in the competitive technology market.
Collaborations
Throughout his career, Min Jun Bae has collaborated with distinguished colleagues, including Jong Youn Kim and Dong Kyu Kim. Together, they have driven innovation at Samsung Electronics Co., Ltd., working on numerous projects that have led to valuable patents and advancements in semiconductor technology.
Conclusion
Min Jun Bae’s innovative contributions to semiconductor packaging reflect his dedication to enhancing technology and improving device performance. His patents underscore the importance of collaboration in driving progress within the semiconductor industry, and his work continues to inspire future innovations in the field.