The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2024
Filed:
Oct. 24, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a redistribution substrate having first and second surfaces opposed to each other, and including an insulation member, a plurality of redistribution layers on different levels in the insulation member, and a redistribution via having a shape narrowing from the second surface toward the first surface in a first direction; a plurality of UBM layers, each including a UBM pad on the first surface of the redistribution substrate, and a UBM via having a shape narrowing in a second direction, opposite to the first direction; and at least one semiconductor chip on the second surface of the redistribution substrate, and having a plurality of contact pads electrically connected to the redistribution layer adjacent to the second surface among the plurality of redistribution layers.