The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2022
Filed:
Jan. 16, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jong Youn Kim, Seoul, KR;
Dong Kyu Kim, Anyang-si, KR;
Jin-Woo Park, Seoul, KR;
Min Jun Bae, Yongin-si, KR;
Gwang Jae Jeon, Hwaseong-si, KR;
Samsung Electronics Co, Ltd., Gyeonggi-Do, KR;
Abstract
A semiconductor package includes a first semiconductor chip including a first surface and a second surface which face each other, an alignment pattern formed on the first surface, a first redistribution layer arranged on the first surface of the first semiconductor chip, a second redistribution layer arranged on the second surface of the first semiconductor chip, and electrically connected with the semiconductor chip, and a first dielectric layer including the alignment pattern between the first redistribution layer and the semiconductor chip, the alignment pattern overlapping the first surface of the first semiconductor chip.