Min Jae Seong

Title: The Innovations of Inventor Min Jae Seong

Introduction: Min Jae Seong, based in Suwon-si, South Korea, is a distinguished inventor with a commendable portfolio comprising three patents. His contributions to the field of electronics and circuit design are notable and reveal a commitment to advancing technology in practical and innovative ways.

Latest Patents: Among his latest patents, Min Jae Seong has developed a sophisticated printed circuit board. This invention is characterized by a unique structure that includes a first insulating layer, a first wiring layer partially buried within that layer, a second insulating layer on top, and another wiring layer incorporated within the second layer. One of the standout features of this circuit board is a cavity that penetrates through the layers, exposing parts of the upper surface of the first insulating layer. Furthermore, the wiring pattern exhibits a step structure, where the upper surface is partially revealed, ensuring functionality and efficiency in electronic applications.

In addition to the printed circuit board, Min has also patented a package board along with a method for its manufacturing. This package board features a first insulating layer with a penetrating cavity and a first connection pad designed to extend through the insulating layer, enhancing its utility in electronic package designs.

Career Highlights: Min Jae Seong is currently associated with Samsung Electro-Mechanics Co., Ltd., a leading company recognized for its innovative contributions to electronic components. His role in this esteemed organization underscores his expertise and the significance of his patents in the market.

Collaborations: Throughout his career, Min has worked closely with his colleagues, including Myung Sam Kang and Young Gwan Ko. Their collaborative efforts highlight the importance of teamwork in driving innovation and developing cutting-edge technology.

Conclusion: As a proficient inventor, Min Jae Seong continues to make notable strides in the field of electronic engineering. His recent patents, focused on printed circuit boards and package boards, reflect both his ingenuity and the potential for future advancements in electronic technology.