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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9793250 B1

PDFFull Text
Date of Patent:
Oct. 17, 2017

Filed:

Apr. 21, 2015

Package board, method for manufacturing the same and package on package having the same

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Myung Sam Kang, Suwon-Si, KR;

Young Gwan Ko, Suwon-Si, KR;

Hye Jin Kim, Suwon-Si, KR;

Hye Won Jung, Suwon-Si, KR;

Min Jae Seong, Suwon-Si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;

Attorney:

NSIP Law

Primary Examiner:

Yuriy Semenenko

Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/14 (2006.01); H01L 25/10 (2006.01); H05K 3/46 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); H01L 23/13 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H05K 3/4682 (2013.01); H01L 23/147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48225 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15311 (2013.01); H05K 3/4697 (2013.01);
Abstract

There are provided a package board, a method for manufacturing the same, and a package on package having the same. The package board according to an exemplary embodiment of the present disclosure includes a first insulating layer formed with a cavity having a penetrating shape; and a first connection pad formed to penetrate through the first insulating layer and formed at one side of the cavity.

Find Patent Forward Citations

Kang, Myung. (2017). Package board, method for manufacturing the same and package on package having the same (U.S. Patent No. 9793250). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9793250

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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