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For the Inventor, By the Inventor

Oregon City, OR, United States of America

Mike Greenwood

This inventor holds 10 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2003-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mike Greenwood. Retrieved from https://idiyas.com/inventor/mike-greenwood

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 40.0

Average Co-Inventor Count = 5.0

ph-index = 4

Forward Citations = 52(Granted Patents)


Company Filing History:

goldMedal10 out of 56,322 
 
Intel Corporation
 patents

Years Active: 2003-2009

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10 patents (USPTO):Explore Patents
1. 7496997 - Method for making a wound capacitor (2009-03-03),
2. 7042702 - Wound capacitor (2006-05-09),
3. 7030460 - Selectable capacitance apparatus and methods (2006-04-18),
4. 6862784 - Method of fabricating a wound capacitor (2005-03-08),
5. 6785118 - Multiple electrode capacitor (2004-08-31),
6. 6751087 - Layered polymer on aluminum stacked capacitor (2004-06-15),
7. 6704187 - Efficient termination for wound capacitors (2004-03-09),
8. 6590762 - Layered polymer on aluminum stacked capacitor (2003-07-08),
9. 6529365 - Multiple terminal SMT BGA-style wound capacitor (2003-03-04),
10. 6519136 - Hybrid dielectric material and hybrid dielectric capacitor (2003-02-11),

Title: Mike Greenwood: Innovator in Wound Capacitor Technology

Introduction

Mike Greenwood is a prominent inventor based in Oregon City, OR (US). He has made significant contributions to the field of capacitor technology, holding a total of 10 patents. His work focuses on enhancing the performance and efficiency of wound capacitors, which are essential components in various electronic devices.

Latest Patents

Among his latest patents is a method for making a wound capacitor. This innovative design features a lead configuration that enables enhanced control over equivalent series resistance (ESR) and equivalent series inductance (ESL). The capacitor is designed with a case that houses a wound foil, and a ball-and-lead configuration is coupled to the foil, extending from the case. This design improves the overall performance of the capacitor in electronic applications.

Career Highlights

Mike Greenwood is currently employed at Intel Corporation, where he continues to develop cutting-edge technologies. His work at Intel has allowed him to collaborate with some of the brightest minds in the industry, further advancing the field of capacitor technology.

Collaborations

Some of his notable coworkers include Peir Chu and Steve Schiveley. Their combined expertise contributes to the innovative environment at Intel Corporation, fostering the development of new technologies.

Conclusion

Mike Greenwood's contributions to the field of wound capacitors demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of electronic components and their applications, solidifying his reputation as a leading inventor in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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