Kawasaki, Japan

Michio Oryoji

USPTO Granted Patents = 4 

Average Co-Inventor Count = 1.6

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2005-2013

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4 patents (USPTO):Explore Patents

Title: Michio Oryoji: Innovator in Semiconductor Technology

Introduction

Michio Oryoji is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on innovative semiconductor devices and their manufacturing methods.

Latest Patents

Oryoji's latest patents include a semiconductor device featuring wirings formed by damascene. This invention involves an insulating film over a semiconductor substrate, with a wiring trench that reaches partway into the thickness of the insulating film. A via hole is strategically placed at the end of the wiring trench, and a barrier metal film covers the inner surfaces of both the trench and the via hole. The design includes an inclined plane connecting the bottom of the trench and the sidewall of the via hole, optimizing the device's performance. Another notable patent details a method for manufacturing a semiconductor device with a wiring trench that is formed under specific etching conditions, ensuring a precise height difference between the filling member and the trench.

Career Highlights

Throughout his career, Michio Oryoji has worked with notable companies such as Fujitsu Corporation and Fujitsu Semiconductor Limited. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Oryoji has collaborated with esteemed colleagues, including Hisaya Sakai and Haruhito Nishibe. Their combined expertise has contributed to advancements in the semiconductor field.

Conclusion

Michio Oryoji's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry and pave the way for future innovations.

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