The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2011
Filed:
Sep. 05, 2006
Michio Oryoji, Kawasaki, JP;
Hisaya Sakai, Kawasaki, JP;
Michio Oryoji, Kawasaki, JP;
Hisaya Sakai, Kawasaki, JP;
Fujitsu Semiconductor Limited, Yokohama, JP;
Abstract
A via hole is formed in the interlayer insulating film on a semiconductor substrate, the via hole reaching the bottom of the interlayer insulating film. A filling member fills a lower partial space in the via hole. A wiring trench continuous with the via hole as viewed in plan is formed, the wiring trench reaching partway in a thickness direction. The wiring trench is formed under the condition that an etching rate of the interlayer insulating film is faster than that of the filling member, in such a manner that a height difference between the upper surface of the filling member and the bottom of the wiring trench is half or less than half the maximum size of a plan shape of the via hole. The filling member in the via hole is removed. The inside of the via hole and wiring trench is filled with a conductive member.