Company Filing History:
Years Active: 2009-2016
Title: Michio Ido: Innovator in Printed Wiring Board Technology
Introduction
Michio Ido, an accomplished inventor based in Ogaki, Japan, has made significant contributions to the field of printed wiring board technology. With a total of five patents to his name, Ido's innovations demonstrate his commitment to advancing electronic component manufacturing processes.
Latest Patents
Ido's recent patents showcase his expertise in methods for manufacturing printed wiring boards. One of his notable inventions outlines a process that involves forming a metal film on an insulative board, applying a plating resist, and subsequently creating a plated-metal film. This method emphasizes the importance of controlled etching to reduce film thickness and facilitate the formation of conductive circuits and solder pads.
Another patent focuses on a similar manufacturing approach, which also includes the application of a solder-resist layer. This invention is pivotal for the production of reliable connections in electronic devices, highlighting Ido's role in enhancing the quality and efficiency of modern circuitry.
Career Highlights
Ido's career is marked by his tenure at Ibiden Company Limited, where he has applied his innovative thinking to the development of advanced electronic solutions. His work not only reflects his personal achievements but also underscores the crucial link between inventive processes and practical applications in the electronics manufacturing sector.
Collaborations
Throughout his career, Ido has collaborated with talented colleagues such as Toru Furuta and Kotaro Takagi. Their combined expertise has undoubtedly contributed to their shared successes in the field, fostering an environment of innovation and knowledge exchange at Ibiden Company Limited.
Conclusion
In conclusion, Michio Ido is a notable inventor in the field of printed wiring board technology, with a robust portfolio of patents that demonstrate his dedication to innovation. His methodologies not only streamline manufacturing processes but also pave the way for enhanced reliability in electronic components, contributing to the evolution of the technology we rely on today.