The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Oct. 20, 2009
Applicants:
Toru Furuta, Ogaki, JP;
Kotaro Takagi, Ogaki, JP;
Michio Ido, Ogaki, JP;
Fumitaka Takagi, Ogaki, JP;
Inventors:
Toru Furuta, Ogaki, JP;
Kotaro Takagi, Ogaki, JP;
Michio Ido, Ogaki, JP;
Fumitaka Takagi, Ogaki, JP;
Assignee:
Ibiden Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract
A printed wiring board has an insulative board having a first surface and a second surface on the opposite side of the first surface, a wiring formed on the first surface of the insulative board and having a pad and a conductive circuit contiguous to the pad, and a metal film formed on the pad. The pad is provided to mount an electronic component having a gold bump. The pad has a thickness which is greater than a thickness of the conductive circuit.