The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2009
Filed:
Dec. 16, 2005
Takahiro Yamashita, Ogaki, JP;
Hiroyuki Watanabe, Ogaki, JP;
Kiyotaka Tsukada, Ogaki, JP;
Michio Ido, Ogaki, JP;
Morio Nakao, Shinjuku-ku, JP;
Takahiro Yamashita, Ogaki, JP;
Hiroyuki Watanabe, Ogaki, JP;
Kiyotaka Tsukada, Ogaki, JP;
Michio Ido, Ogaki, JP;
Morio Nakao, Shinjuku-ku, JP;
IBIDEN Co., Ltd., Ogaki-shi, JP;
Abstract
This invention provides a printed wiring board having an intensified drop impact resistance of a joint portion between pad and solder. An electrode pad comprises pad portion loaded with solder ball and a cylindrical portion projecting to the solder ball supporting the pad portion. An outer edge of the pad portion extends sideway from a cylindrical portion so that the outer edge is capable of bending. If the outer edge bends when stress is applied to the solder ball, stress on the outer edge of the pad portion on which stress is concentrated can be relaxed so as to intensify the joint strength between an electrode pad and solder ball.