This inventor holds 2 USPTO granted patents. Top assignee: Siemens Aktiengesellschaft. Active years: 1977.
Company Filing History:
Years Active: 1977
Title: Michail Sapunarow: Innovator in Multi-Chip Wiring Arrangements
Introduction
Michail Sapunarow is a notable inventor based in Munich, Germany. He has made significant contributions to the field of electronics, particularly in the development of multi-chip wiring arrangements. With a total of 2 patents, his work has advanced the technology used in electronic devices.
Latest Patents
Sapunarow's latest patents include a process for the production of a multi-chip wiring arrangement. This innovative process involves creating a ceramic carrier with through contact holes, which are associated with thin film wiring on one side and multi-layer, thick layer wiring on the other. The metallization and galvanic strengthening of the holes on one side, along with the sealing of the other side by baking a thick layer of paste, are key steps in this process. His second patent focuses on producing a multi-chip wiring arrangement that facilitates high packing density and reliable flip-chip connections. This process includes vapor deposition of an adhesive layer and a contact layer onto a carrier, followed by galvanic metal deposition to create the desired structure.
Career Highlights
Sapunarow is currently employed at Siemens Aktiengesellschaft, where he continues to innovate in the field of electronics. His work has been instrumental in enhancing the efficiency and reliability of electronic components.
Collaborations
Some of his notable coworkers include Artur Weitze and Wolfgang Bade. Their collaboration has contributed to the successful development of advanced technologies in their field.
Conclusion
Michail Sapunarow's contributions to the field of multi-chip wiring arrangements demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of the complexities involved in electronic design and manufacturing.