The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 1977
Filed:
Sep. 02, 1975
Michail Sapunarow, Munich, DT;
Wolfgang Bade, Munich, DT;
Siemens Aktiengesellschaft, Berlin & Munich, DT;
Abstract
A process for producing multi-chip wiring which facilitates high packing density and reliable flip-chip connections. In the process, an adhesive layer and a contact layer are vapor deposited onto a carrier. The desired structure of the connector path, outer contacts and connection surfaces are covered with a conductive layer and an intermediate layer with the aid of a first photo-lacquer mask by galvanic metal deposition. A solder-rejecting layer is galvanically deposited onto the structure of the conductor paths with the aid of a second photo-lacquer mask. The undesired regions of the adhesive layer and of the contact layer are etched away and the outer contacts and connection surfaces are covered with a solderable contact layer by selective currentless metal deposition.