The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 1977
Filed:
Sep. 02, 1975
Applicant:
Inventors:
Artur Weitze, Munich, DT;
Michail Sapunarow, Munich, DT;
Assignee:
Siemens Aktiengesellschaft, Berlin & Munich, DT;
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ;
U.S. Cl.
CPC ...
29625 ; 29628 ; 174 685 ; 427 96 ; 427 97 ;
Abstract
A process for producing multi-chip wiring arrangements which consist of a ceramic carrier with through contact holes associated with thin film wiring on one side of the carrier and with multi layer, thick layer wiring on the other side of the carrier. The holes on the one side of the carrier are metallized and galvanically strengthened while the holes on the other side of the carrier are sealed by baking therein a thick layer of paste. Thereafter the multi layer, thick layer wiring and the thin film wiring are produced in that order.