Warrington, PA, United States of America

Michael T Deley

This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignees: Kulicke and Soffa Industries, Inc., Quad Systems Corporation. Active years: 1996-2012.

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 79(Granted Patents)


Company Filing History:


Years Active: 1996-2012

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3 patents (USPTO):Explore Patents

Title: Michael T Deley: Innovator in Semiconductor Processing

Introduction

Michael T Deley is a notable inventor based in Warrington, PA (US), recognized for his contributions to semiconductor processing. With a total of three patents to his name, Deley's work has significantly impacted the field of wire bonding operations.

Latest Patents

One of Deley's latest patents is a method of teaching eyepoints for wire bonding and related semiconductor processing operations. This innovative method involves selecting a group of shapes from a region of a semiconductor device to be used as an eyepoint. The process includes teaching the eyepoint to a wire bonding machine using either a sample semiconductor device or predetermined data related to the semiconductor device. The teaching step is crucial as it defines the locations of each of the shapes with respect to one another.

Career Highlights

Throughout his career, Michael T Deley has worked with prominent companies in the semiconductor industry, including Kulicke and Soffa Industries, Inc. and Quad Systems Corporation. His experience in these organizations has allowed him to refine his skills and contribute to advancements in semiconductor technology.

Collaborations

Some of Deley's notable coworkers include Peter M Lister and Deepak Sood, who have collaborated with him on various projects within the semiconductor field.

Conclusion

Michael T Deley stands out as an influential inventor in the semiconductor processing industry. His innovative methods and collaborative efforts have paved the way for advancements in wire bonding operations.

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