The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2011

Filed:

Mar. 13, 2007
Applicants:

Michael T. Deley, Warrington, PA (US);

Peter M. Lister, Warrington, PA (US);

Deepak Sood, New Britain, PA (US);

Zhijie Wang, Chalfont, PA (US);

Inventors:

Michael T. Deley, Warrington, PA (US);

Peter M. Lister, Warrington, PA (US);

Deepak Sood, New Britain, PA (US);

Zhijie Wang, Chalfont, PA (US);

Assignee:

Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 31/00 (2006.01); B23K 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.


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