Kulicke and Soffa Industries, Inc.

Quad Systems Corporation

Michael T Deley

Deepak Sood

Zhijie Wang

Peter M Lister

Edwin R Phillips

A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

Apparatus and a method for determining the position of a component held on the end of a pick up tool includes a pick up tool and positioning sensing system mounted on a movable frame with each other. The position sensing system includes an adjustable light source for producing an intense fan of light onto a collimating lens. The collimating lens produces an object field comprising a thin wide sheet of collimated light to be projected on a component held by the pick up tool. The thin wide sheet of light is projected on a component whose position is to be determined and the unblocked rays of light are projected onto an objective focusing lens which focuses the unblocked light through a very small aperture onto a relay lens which receives the refocused unblocked rays of light and produces refocused collimated light rays which are directed as an image onto a linear array sensor having a plurality of high density pixel sensors whose position is known relative to the pick up tool. The component whose position is to be determined is rotated in the imaging field. A computer/controller is coupled to the linear array sensor and an encoder for producing sets of X, Y and O-- data indicative of the refocused collimated light rays projected onto said pixel sensor and the computer/controller is programmable for analyzing said digital data and for determining the X, Y and O-- position of the component on the pick up tool.

Growing community of inventors

Warrington, PA, United States of America

Michael T Deley