Dresden, Germany

Michael Stadtmüller

This inventor holds 2 USPTO granted patents. Top assignee: Infineon Technologies Ag. Active years: 2006-2009.


% Patents Active = 50.0

Average Co-Inventor Count = 5.3

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2006-2009

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2 patents (USPTO):Explore Patents

Title: Michael Stadtmüller: Innovator in Semiconductor Technology

Introduction

Michael Stadtmüller is a prominent inventor based in Dresden, Germany. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to solving complex engineering challenges.

Latest Patents

Stadtmüller's latest patents include a trench capacitor structure and a process for applying a covering layer and a mask for trench etching processes in semiconductor substrates. This invention introduces a stress relief layer made from thermally produced silicon nitride, which replaces the conventional silicon dioxide layer. This advancement streamlines the overall processing by reducing restrictions imposed during subsequent process steps, such as wet-etching. His second patent focuses on minimizing the vapor deposition of tungsten oxide during the selective side wall oxidation of tungsten-silicon gates. This process effectively prevents or greatly reduces tungsten oxide deposition, enhancing the efficiency of gate structure treatments.

Career Highlights

Michael Stadtmüller is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in the industry.

Collaborations

Stadtmüller has collaborated with notable colleagues, including Olaf Storbeck and Henry Bernhardt. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Michael Stadtmüller is a key figure in the semiconductor industry, with a focus on innovative solutions that enhance manufacturing processes. His contributions through patents and collaborations continue to shape the future of technology.

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